Forenprogramm der electronica 2026
Auf den electronica Foren tauscht sich die Elektronikbranche zu praxisrelevantem Wissen aus nahezu allen Anwendungsfeldern aus. Was die Branche bewegt, wird in hochkarätigen Vorträgen und Diskussionsrunden erörtert.
Embedded Systems Forum
Obsolescence Day
IIoT Forum
Cyber Security Forum
Automotive Forum
PCB, EMS & Components Marketplace
Printed Electronics Forum
bis Embedded Systems Forum(E10-1) From Embedded Intelligence to Physical AI: Why Systems Architecture Will Define Next Generation Smart Machines bis Embedded Systems Forum(E10-2) Panel Discussion: Building the Embedded Platforms for Tomorrow's Mobility - From Silicon to Software-Defined Vehicles bis Embedded Systems Forum(E10-3) From Hazard to Assurance: Functional Safety Across Domains bis Embedded Systems Forum(E10-4) Physical AI at the Point of Action: Actuation, Sensing and Connectivity for Intelligent Robotics bis Embedded Systems Forum(E10-5) From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception bis Embedded Systems Forum(E10-6) Application of novel soft magnetic composites (SMCs) in high-power magnetic devices bis Embedded Systems Forum(E10-7) The Next Engineering Paradigm: Enabling the Future of Physical AI Through Platform Contextual Intelligence bis Embedded Systems Forum(E10-8) Putting Platform Contextual Intelligence into Practice for Physical AI bis Embedded Systems Forum(E10-9) Risk Assessment and Secure-by-Design Strategies for EU Cyber Resilience Act Compliance bis Embedded Systems Forum(E10-11) Beyond Part Search: A New Model for Solution Discovery bis Embedded Systems Forum(E10-12) Agentic Hardware Engineering: Why Start with Requirements bis Embedded Systems Forum(E10-14) February 2027: When Every Battery Must Be Replaceable. Is Your Product Ready? bis Embedded Systems Forum(E10-15) Connectivity in Motion: Interconnect Design Considerations for Humanoid Robots bis Obsolescence DayGeopolitical Challenges, Supply Chain Risks, and Proactive Obsolescence Management bis Obsolescence DayIntegrating Supply Chain Transparency into Obsolescence Management bis Obsolescence DayIncorporating Obsolescence Management from the Start—Beginning with the Product Development Process bis Obsolescence DayObsolescence and the Supply Chain bis Obsolescence DayCounterfeit Electronic Components in the Supply Chain: Risks and Advanced Detection Methods bis Obsolescence DayThe Holistic Life Cycle Check-Up as an Entry Point into Obsolescence Management – A Practical Case Study bis Obsolescence DaySustaining Electronics Availability Through Rework and Modification in Modern Obsolescence Management bis Obsolescence DayThe most sustainable component is the one that already exists—how avoiding obsolescence combines sustainability and cost efficiency bis IIoT ForumBringing Hardware-Accelerated to Edge AI bis IIoT ForumQualcomm Dragonwing: Modernizing Industrial Automation for the AI Era bis IIoT ForumMitigating Security Risks In the Era of Quantum Attacks bis IIoT ForumAI at the Edge for IIoT bis Cyber Security ForumCyber Security Forum Welcome & Opening Remarks bis Cyber Security ForumCRA in Practice: What Manufacturers Need to Do Today to Succeed Tomorrow bis Cyber Security ForumHow the Cyber Resilience Act (CRA) influences MCU / SoC / FPGA selection bis Cyber Security ForumFuture-Proofing the Automotive Supply Chain under the EU Cyber Resilience Act bis Cyber Security ForumCyber Resilience Starts in Silicon: Securing AI-Enabled IoT Systems Through Hardware Roots of Trust bis Cyber Security ForumCyber Security Forum Part 1 Closing Remarks & Break bis Cyber Security ForumCyber Security Forum Part 2 Opening Remarks bis Cyber Security ForumCRA: The New Rules of Engineering Connected Product bis Cyber Security ForumFrom CRA requirements to action: how AI can help companies comply with CRA bis Cyber Security ForumBuilding trust in frontier technologies: cyber resilience for edge AI bis Cyber Security ForumCybersecurity, AI & regulation: are engineering teams ready for the CRA era? bis Cyber Security ForumCyber Security Forum Closing Remarks bis Cyber Security ForumElectronics Excellence Awards bis Automotive ForumAURIXTM TC4x PPU: Two Paths to OEM Profitability in the E Drivetrain bis Automotive ForumBeyond Isolation: Enabling the Next Generation of 800V Electric Vehicle Architectures bis Automotive ForumThe true enabler for single stage Onboard Charger: Introducing the innovative and unique Automotive CoolGaN™ Bi-directional Switch bis Automotive ForumLi Auto's Holistic Optimization of E Drive Efficiency: From Vehicle Architecture to Chip Design bis Automotive ForumSoftware-Based E/E Architectures: Enabling SDV Architecture bis Automotive ForumZone Controllers at the heart of SDV bis Automotive ForumDriving Trust at the Edge - MACsec 2.0: Securing Physical AI for SDVs and Robotics bis Automotive ForumSmart and Softwareless Endpoints in context of Software-Defined Vehicle bis Automotive ForumPowering the Software-Defined Vehicle Era bis Automotive ForumThe End of the Edge MCU? Smart Endpoints as a Foundation for Software-Defined Vehicles bis PCB, EMS & Components MarketplaceBeyond Conventional Solder Mask: Unlocking New Potential in PCB Design Through Additive Technology bis PCB, EMS & Components MarketplaceCutting costs with SMT & THR – A TCO perspective bis PCB, EMS & Components MarketplacePCB Power Integrity and Thickness Challenges in Next-Generation AI Hardware bis PCB, EMS & Components MarketplaceFrom Concept to Deployment: Speeding Up AI & Ruggedised Computing bis PCB, EMS & Components MarketplaceValidierung als Schlüssel für die Innovationskraft der Zukunft bis PCB, EMS & Components MarketplaceFrom Zip to Quote in Hours: Automating PCB & PCBA Quoting with Should-Cost Analysis bis Printed Electronics ForumIntroduction to Flexible and Printed Electronics bis Printed Electronics ForumNext-generation roll-to-roll printed and hybrid electronics technologies towards smarter, flexible, lighter weight, and sustainable functional solutions bis Printed Electronics ForumWhen should you NOT use printed electronics? bis Printed Electronics ForumSoftware Defined Functions: New Avenues for Printed Electronics? bis Printed Electronics ForumWhen Every Micron Counts: Printing, Repairing and Tuning Circuits at the 1 µm Scale bis Printed Electronics ForumPrinted electronics: a responsible alternative for PCBs bis Printed Electronics ForumCompostable electronics as a reality bis Printed Electronics ForumA Circular Ink–Machine Pairing: Fully Recyclable Functional Ink Meets High‑Speed Industrial Screen Printing bis Printed Electronics ForumTowards sustainable electronics – recent developments on paper-based electronics bis Printed Electronics ForumSummary & Adjourn
