Chiplets Forum
Chiplets: Building the Future of SoCs
Chiplets, also known as heterogeneous multi-die systems, are increasingly seen as the future of system on chips (SoCs). They offer a solution that meets the growing demand for high-performance computing in various industries, which has been fueled by the widespread adoption of AI technology.
The Chiplets Forum
The Chiplets Forum will explore the complex considerations surrounding chiplet-based systems. Presentations and discussions will cover the entire value chain and ecosystem, from initial concept and design exploration to packaging and testing. Additionally, the event will explore the emergence of initiatives to establish a chiplet marketplace and examine relevant standards and the feasibility of these endeavors.
Focus topics 2026
- Chiplet Concepts – Principles and Promise
- Chiplet Design Tools & Ecosystem
- Integration of Chiplets from multiple vendors
Who is the audience for the forum?
The construction of future system on chips (SoCs) using chiplets requires a diverse range of disciplines, making this event relevant to anyone involved in the value chain of constructing 2.5D and 3D stacked heterogeneous systems that incorporate chiplet-style architectures. No matter your area of expertise—design, validation, packaging, testing, or related services—you will find valuable insights at this forum.
Participating in the forum as an exhibitor?
Under certain conditions, you can participate in the Chiplets Forum as an exhibitor with a contribution. For more information, please contact:
Jürgen Hübner
j.hubner@aspencore.com
Additional presentation and sponsorship opportunities for exhibiting and non-exhibiting companies are available in the Exhibitor Shop
Event details
Where?
Semiconductor Innovation Stage, Hall C6
When?
November 12, 2026
