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Fairgrounds map 2024

Please note: This is a preliminary plan. In the course of the space allocation, changes in hall occupancy may occur.

Current fairgrounds map for download

Exhibition areas

Halls A1 and B1 | EMS, PCBs and other circuit carriers

EMS Electronic manufacturing services

PCBs and other circuit carriers

Forums at the PCB, EMS & Components Marketplace in hall A1:

Halls A2, B2 and B3 | Electromechanics and system peripherals

Electromechanics

System peripherals

Interconnection components

Casing technology

Relays

Switches

Keyboards

Hall A3 | Test and measurement

Test and measurement

Hall A4 | Power supplies

Power supplies

Forums at the electronica Stage:

Halls A5 + A6 | Passive components

Passive components

Forums at the Power Efficiency Stage in hall A5:

Hall B3 | Sensor technology, micro- and nanosystems (NEMS, MEMS)

Sensor technology

Micro- and nanosystems (NEMS, MEMS)

Hall B4 | Embedded Systems and Semiconductors

Embedded systems

Semiconductors

Forum at the Start-up Stage:

  • electronica Fast Forward Forum

Forums at the Visionary Stage:

electronica Career Area

  • Career advice
  • Job exchange

Halls B4, B5, C3, C4 und C5 | Semiconductors

Semiconductors

Forum at the Start-up Stage in hall B4:

  • electronica Fast Forward Forum

Forums at the Visionary Stage in hall B4:

Forums at the Future Control Stage in hall C5:

electronica Career Area in hall B4

  • Career advice
  • Job exchange

Halls B6 | Displays, Automotive, Wireless

Displays

Automotive

Wireless

Forums at the Smart Mobility Stage:

Halls C1 + C2 | SEMICON Europa 2024

SEMICON Europa

TechARENA

Executive Forum

Hall C6 | EMS, PCBs, Electromechanics and System Peripherals

EMS Electronic manufacturing services

PCBs and other circuit carriers

Electromechanics and System peripherals

ICM | electronica Conferences

Conferences at the ICM – International Congress Center Messe München

electronica conferences

SEMICON Europa conferences

  • MEMS & Imaging Sensors Summit
  • Fab Management Forum (FMF)
  • Advanced Packaging Conference (APC)

In all halls: Assemblies, Automotive, ED/EDA, Embedded Systems, Services, Servo-technology, Subsystems