electronica 2026 Forum Program

At the electronica forums, professionals from the electronics industry share practical knowledge from nearly all fields of application. High-profile presentations and panel discussions cover the issues shaping the industry.

Nov 10 Nov 11 Nov 12 Nov 13

Embedded Systems Forum

Obsolescence Day

IIoT Forum

Automotive Forum

PCB, EMS & Components Marketplace

Printed Electronics Forum

(E10-1) From Embedded Intelligence to Physical AI: Why Systems Architecture Will Define Next Generation Smart Machines (E10-2) Panel Discussion: Building the Embedded Platforms for Tomorrow's Mobility - From Silicon to Software-Defined Vehicles (E10-3) From Hazard to Assurance: Functional Safety Across Domains (E10-4) Physical AI at the Point of Action: Actuation, Sensing and Connectivity for Intelligent Robotics (E10-5) From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception (E10-7) The Next Engineering Paradigm: Enabling the Future of Physical AI Through Platform Contextual Intelligence (E10-8) Putting Platform Contextual Intelligence into Practice for Physical AI (E10-9) Risk Assessment and Secure-by-Design Strategies for EU Cyber Resilience Act Compliance (E10-11) Beyond Part Search: A New Model for Solution Discovery (E10-12) Agentic Hardware Engineering: Why Start with Requirements (E10-14) February 2027: When Every Battery Must Be Replaceable. Is Your Product Ready?Geopolitical Challenges, Supply Chain Risks, and Proactive Obsolescence Management Integrating Supply Chain Transparency into Obsolescence Management Incorporating Obsolescence Management from the Start—Beginning with the Product Development Process Obsolescence and the Supply Chain Counterfeit Electronic Components in the Supply Chain: Risks and Advanced Detection Methods The Holistic Life Cycle Check-Up as an Entry Point into Obsolescence Management – A Practical Case Study Sustaining Electronics Availability Through Rework and Modification in Modern Obsolescence Management The most sustainable component is the one that already exists—how avoiding obsolescence combines sustainability and cost efficiency Qualcomm Dragonwing: Modernizing Industrial Automation for the AI Era Mitigating Security Risks In the Era of Quantum Attacks AI at the Edge for IIoT Right-Sizing the MCU for Automotive DC/DC Control: Balancing Cost, Performance, and Platform Evolution Beyond Isolation: Enabling the Next Generation of 800V Electric Vehicle Architectures Li Auto's Holistic Optimization of E Drive Efficiency: From Vehicle Architecture to Chip Design Software-Based E/E Architectures: Enabling SDV Architecture Zone Controllers at the heart of SDV Driving Trust at the Edge - MACsec 2.0: Securing Physical AI for SDVs and Robotics Powering the Software-Defined Vehicle Era The End of the Edge MCU? Smart Endpoints as a Foundation for Software-Defined Vehicles Cutting costs with SMT & THR – A TCO perspective PCB Power Integrity and Thickness Challenges in Next-Generation AI Hardware From Concept to Deployment: Speeding Up AI & Ruggedised Computing Introduction to Flexible and Printed Electronics Next-generation roll-to-roll printed and hybrid electronics technologies towards smarter, flexible, lighter weight, and sustainable functional solutions When should you NOT use printed electronics?Software Defined Functions: New Avenues for Printed Electronics?When Every Micron Counts: Printing, Repairing and Tuning Circuits at the 1 µm Scale Compostable electronics as a reality A Circular Ink–Machine Pairing: Fully Recyclable Functional Ink Meets High‑Speed Industrial Screen Printing Towards sustainable electronics – recent developments on paper-based electronics Summary & Adjourn