PCB Power Integrity and Thickness Challenges in Next-Generation AI Hardware

Next-generation AI accelerators and networking systems are driving higher current, heavier copper, greater layer counts, and increasingly complex PCB constructions. Beyond the industry's traditional focus on low-loss materials for signal integrity, these systems also require effective high-frequency decoupling and tight control of PDN impedance. This presentation examines the material and stack-up challenges created by these trends, including dielectric thickness, dielectric constant, copper characteristics, and overall board thickness. Design, reliability, and manufacturing tradeoffs will also be discussed.