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Higher Manufacturing Throughput and Efficient OTA with Flash

NOV
11
2020
11. NOV 2020

Lecture Embedded Forum > IoT, Connectivity, Security

14:40-15:00 h | Virtual

Due to the popularity and ease-of-use of NOR flash memories, system designers often overlook the architecture’s slower erase and program performance, and engineers under time constraints to develop and validate new designs might not consider these factors. System architects have focused instead to ensure that the overall system level requirement for data logging or power-down / power-up recovery can be supported by the erase and program specifications. Since the amount of data or code updated is limited in scope, most NOR flash devices are sufficient. In this presentation, Winbond will explain how faster erase and program capabilities can improve not only manufacturing throughput (thus lowering costs) but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data is remotely updated.

Subjects: Embedded systems

Speaker: Jackson Huang (Winbond Electronics)

Type: Lecture

Speech: English

Due to the popularity and ease-of-use of NOR flash memories, system designers often overlook the architecture’s slower erase and program performance, and engineers under time constraints to develop and validate new designs might not consider these factors. System architects have focused instead to ensure that the overall system level requirement for data logging or power-down / power-up recovery can be supported by the erase and program specifications. Since the amount of data or code updated is limited in scope, most NOR flash devices are sufficient. In this presentation, Winbond will explain how faster erase and program capabilities can improve not only manufacturing throughput (thus lowering costs) but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data is remotely updated.

Jackson Huang

Jackson Huang is the Senior Director of Technical Marketing at Winbond.  With over 25 years of experience in marketing for automotive, consumer, and industrial products, Jackson focuses in managing and driving critical marketing functions to achieve revenue and market share goals.  Prior to joining Winbond Jackson was the Vice President of Marketing for Product Marketing, Segment Marketing, and Ecosystems Development at Cypress and Spansion.  Jackson held various marketing management positions at Trident Microsystems and Advanced Micro Devices for SoC and memory products.  Prior to moving to technology marketing, Jackson was a senior engineer at Fujitsu Microelectronics and Watkins Johnson where he worked on 32 bit MCUs and radar signal processing systems. Jackson is the co-inventor of three flash patents and holds a BS in electrical engineering from the University of Michigan Ann Arbor and MBA in marketing and international business from Santa Clara University.

Jackson Huang

Winbond Electronics

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Jackson Huang

Jackson Huang is the Senior Director of Technical Marketing at Winbond.  With over 25 years of experience in marketing for automotive, consumer, and industrial products, Jackson focuses in managing and driving critical marketing functions to achieve revenue and market share goals.  Prior to joining Winbond Jackson was the Vice President of Marketing for Product Marketing, Segment Marketing, and Ecosystems Development at Cypress and Spansion.  Jackson held various marketing management positions at Trident Microsystems and Advanced Micro Devices for SoC and memory products.  Prior to moving to technology marketing, Jackson was a senior engineer at Fujitsu Microelectronics and Watkins Johnson where he worked on 32 bit MCUs and radar signal processing systems. Jackson is the co-inventor of three flash patents and holds a BS in electrical engineering from the University of Michigan Ann Arbor and MBA in marketing and international business from Santa Clara University.

Jackson Huang
Flash Memory Senior Marketing Director

Location

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
B0
B1
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A1
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