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Lecture electronica Conferences > electronica Embedded Platforms Conference > Track 3: Sensors & IOT
12:10-12:40 h | Virtual
Objectives
Autonomous driving, XR, and machine learning are applications driving new performance demands and introducing a need for specialized chips that provide the necessary power. Chiplets have emerged as an alternative to overcoming scaling, cost, and time-to-market challenges. This evolution could deliver the next generation of powerful processors in record time and significantly less costs than traditional means. Therefore, semiconductor manufacturers need to update their processes to the chiplet model to build innovative new chips.
Methods
The basic idea of a chiplet is that you have a menu of modular chips available in a library. These have been pre-developed and pre-tested. Manufacturers then assemble those chiplets into a package, connecting them using a die-to-die interconnect scheme. Chiplets have different functions such as I/Os, memory and processor cores. By offering them in a package, customers can mix-and-match based on their needs. Think of these chiplets like high-tech Lego blocks semiconductor companies can seamlessly connect to build innovative new chips.
Results
How companies choose to put chiplets together will enable them to set themselves apart. One company may choose more memory, another company may focus on reducing cost. As new chiplets that support the standardized interconnect schemes come to market, semiconductor manufacturers' options increase.
The chiplet model can reduce the design cycle time and costs while providing relatively equivalent performance to meet compute demands.
Conclusions
Chiplets are the future of chip design, which has yet to be tapped. They have the potential to deliver powerful processors at lower costs than traditional means. As the library of chiplets grows, so too will the options and abilities to innovate with them. There is no blueprint with chiplets, thus no limit to how they can be put together to form the foundation for tomorrow's applications.
Subjects: Embedded systems
Speaker: Syed Adam (Accenture)
Type: Lecture
Speech: English
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Speaker,
Accenture
Syed is global lead for Accenture’s semiconductor practice. He advises companies in the semiconductor, electronics, and high tech industries on operations transformation and merger integration. With more than a decade of consulting experience, he specializes in business and operational strategy development, mergers and acquisitions, international expansion, supply chain management, fixed asset management and organizational change management.
Speaker,
Accenture
Syed is global lead for Accenture’s semiconductor practice. He advises companies in the semiconductor, electronics, and high tech industries on operations transformation and merger integration. With more than a decade of consulting experience, he specializes in business and operational strategy development, mergers and acquisitions, international expansion, supply chain management, fixed asset management and organizational change management.