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Lecture Power Electronics Forum > Power Semiconductors & Components
10:40-11:00 h | Virtual
Addressing the many design challenges todays engineers face with high performance, high power and high frequency designs, in this session we look at Nexperia’s next-generation HV power GaN FET technology. Including the innovative CCPAK package, a low parasitic, high-performance power package designed with all copper-clip technology, also providing enhanced reliability and ease of SMD manufacturing.
Subjects: Power Electronics
Speaker: Dr. Dilder Chowdhury (Nexperia)
Type: Lecture
Speech: English
Addressing the many design challenges todays engineers face with high performance, high power and high frequency designs, in this session we look at Nexperia’s next-generation HV power GaN FET technology. Including the innovative CCPAK package, a low parasitic, high-performance power package designed with all copper-clip technology, also providing enhanced reliability and ease of SMD manufacturing.
Speaker,
Nexperia