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Next generation HV power GaN technology and the benefits of copper-clip SMD packaging (CCPAK)

NOV
12
2020
12. NOV 2020

Lecture Power Electronics Forum > Power Semiconductors & Components

10:40-11:00 h | Virtual

Addressing the many design challenges todays engineers face with high performance, high power and high frequency designs, in this session we look at Nexperia’s next-generation HV power GaN FET technology. Including the innovative CCPAK package, a low parasitic, high-performance power package designed with all copper-clip technology, also providing enhanced reliability and ease of SMD manufacturing.

Subjects: Power Electronics

Speaker: Dr. Dilder Chowdhury (Nexperia)

Type: Lecture

Speech: English

Addressing the many design challenges todays engineers face with high performance, high power and high frequency designs, in this session we look at Nexperia’s next-generation HV power GaN FET technology. Including the innovative CCPAK package, a low parasitic, high-performance power package designed with all copper-clip technology, also providing enhanced reliability and ease of SMD manufacturing.

Speaker,
Nexperia

Dr. Dilder Chowdhury

Dr. Dilder Chowdhury

Nexperia

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Informations

Speaker,
Nexperia

Dr. Dilder Chowdhury
Dr. Dilder Chowdhury
Strategic Marketing Director

Location

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
B0
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6

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