Quantum Diamonds – Enabling next-generation chipmaking by revealing every hidden defect.

This talk addresses a bottleneck created by advanced packaging: once dies are stacked, bonded, and encapsulated, the defect site is no longer physically accessible, and every  conventional option costs either resolution, access, or the sample itself.
We will present the solution now in production use for failure analysis. The QDm.1 applies widefield magnetic imaging based on nitrogen-vacancy (NV) centers, atomic-scale quantum sensors in the diamond lattice. Since magnetic fields are not attenuated by silicon, metal, or molding compound, current paths are mapped through the full stack with micrometer precision, without sample preparation or decapsulation, leaving the device intact. We present achieved performance and experience from deployed customer systems.