Powering AI compute: Why PCBs are becoming critical infrastructure

AI compute is reshaping the physical infrastructure behind digital performance. Higher system voltages, extreme current density, rising thermal loads and shrinking delivery distances are transforming how power moves from the rack to the silicon. As power, data and heat increasingly converge at board level, the PCB is becoming a critical part of the system architecture. This presentation explores how advanced PCB integration, including vertical power delivery, embedded capacitance and thermal structures, can enable more efficient, scalable, and reliable AI infrastructure while maintaining manufacturability.