(P11-8) Advanced cooling, higher performance: double-side cooled GaN transistors

Double-side cooled (DSC) packages enable heat removal from both the top and bottom surfaces of the device, significantly improving thermal performance compared with single-side cooled solutions. The lower thermal resistance and dual thermal extraction paths of CoolGaN™ in the DSC package enable higher power density, increased current capability, improved efficiency, and enhanced reliability. The DSC package combines a low package height with the creepage and clearance requirements of the 650 V class power devices, while supporting larger die sizes and lower RDS(on) devices in a compact footprint with low package parasitics. Its reduced height can provide additional space for a thicker cold plate within the same overall system height, while the dual-sided thermal path supports improved heat extraction.