CEO Roundtable

Jean-Marc Chery is STMicroelectronics’ President and Chief Executive Officer and has held this position since May 31st, 2018. He is the Sole Member of ST’s Managing Board and chairs its Executive Committee.

Chery began his career in the Quality organization of Matra, the French engineering group. In 1986, he joined Thomson Semiconducteurs, which subsequently became ST, and held various management positions in product planning and manufacturing, rising to lead ST’s wafer fabs in Tours, France, and later in Rousset, France. In 2005, Chery led the company-wide 6-inch wafer-production restructuring program before taking charge of ST’s Front-End Manufacturing operations in Asia Pacific. In 2008, he was promoted to Chief Technology Officer and assumed additional responsibilities for Manufacturing and Quality (2011) and the Digital Product Sector (2012). In 2014, Chery was appointed ST’s Chief Operating Officer responsible for Technology and Manufacturing operations. In July 2017, Chery was appointed Deputy CEO with overall responsibility for Technology and Manufacturing, as well as for Sales and Marketing operations.

Chery is a member of the Board of Directors at Legrand and Chairman of the France—Malaysia Business Council at Medef International. Previously, he was President of the European microelectronics R&D program AENEAS and served as President of the European Semiconductor Industry Association (ESIA) in 2019- 2021. Chery was promoted Knight of the Legion of Honor by the French Ministry of Economy and Finance in July 2019.

Jean-Marc Chery was born in Orleans, France, in 1960, and graduated with a degree in Engineering from the ENSAM engineering school in Paris, France.

Updated February 2022

Jochen Hanebeck ist seit April 2022 CEO von Infineon und seit 2016 Mitglied des Vorstands.

Er wurde in Dortmund geboren und hat ein Diplom in Elektrotechnik der Rheinisch-Westfälischen Technischen Hochschule Aachen. Seine Laufbahn bei Infineon (bis 1999 Siemens AG) begann er 1994 als Entwicklungsingenieur am Standort in East Fishkill, USA. Vor seiner Tätigkeit im Vorstand hatte er bei Infineon verschiedene Management-Positionen inne, darunter von 2008 bis 2016 die Leitung der Division Automotive.

Gregg Lowe joined Cree, Inc. (now Wolfspeed) in September 2017 as president and chief executive officer (CEO) to translate vision and strategy into world- class execution and bottom-line growth.

Prior to Wolfspeed, he served as president and CEO of Freescale Semiconductor, a $5 billion global company with products serving automotive, industrial, consumer and communications markets. During his time at Freescale, Gregg led the successful merger with NXP Semiconductors N.V. creating a high- performance, mixed-signal semiconductor industry leader, with combined revenue of more than $10 billion. Prior to Freescale, Gregg had a long career spanning 28 years at Texas Instruments including executive roles as senior vice president and leader of the analog business.

In addition to his roles as a corporate executive, Gregg also holds numerous board positions including Silicon Labs in Austin, Texas; Semiconductor Industry Association in Washington, DC; and The Rock and Roll Hall of Fame in Cleveland, Ohio, where he serves as chairman of the board.

Gregg holds a Bachelor of Science in Electrical Engineering from the Rose-Hulman Institute of Technology, (where he played football for the “Fighting Engineers”) and has completed the executive program at Stanford University. He is the recipient of the Rose-Hulman Institute of Technology Career Achievement Award, which honored both his accomplishments in the semiconductor industry as well as his community service, and he was awarded an Honorary Doctorate of Engineering from the Institute in 2014.

Gregg is married and has two adult children. His career spans living in Houston, Detroit, Munich, Nice, Dallas, Austin, and now Durham, NC. He is fluent in German.

Kurt Sievers has been President and Chief Executive Officer of NXP Semiconductors since May 2020.

Kurt Sievers has been a member of NXP's executive management team since 2009 and was instrumental in defining and implementing NXP's strategy for "secure connectivity for a smarter world." Prior to being elected CEO, he served as President of NXP, overseeing all of the company's business units. In 2019, Kurt led the successful acquisition of Marvell's Wi-Fi Connectivity Business Unit. This enabled NXP to provide scalable processing and connectivity solutions to customers in NXP's key end markets. In 2015, he played a key role in the merger of NXP and Freescale Semiconductor. It created one of the world's leading semiconductor companies, primarily pioneering the automotive industry and secure edge processing.

Kurt Sievers joined NXP in 1995 and progressed through a series of leadership positions in sales and marketing, product definition and development, strategy and general management in a variety of market segments.

Education

Kurt Sievers holds a Master of Science in Physics and Information Technology from the University of Augsburg.

Board positions

• Managing Director, NXP Semiconductors N.V.
• Member of the Board of the German Electrical and Electronic Manufacturers' Association (ZVEI)

• Chairman of the Advisory Board of the International Trade Fair Electronica
• Board member of the Global Semiconductor Alliance (GSA)
• Board member of AENEAS, an industry association promoting R & D&I to strengthen EU competitiveness
• Member of the German Asia-Pacific Business Association (OAV) Committee

Interests

Kurt Sievers has a passion for mountain sports, desert travel, digital photography and Land Rover.
He enjoys spending time with his family and enjoying Mediterranean food and wine.