(P12-13) Compact µModules for Next-Generation ATE Power

Semiconductor test equipment is driving simultaneous demands for higher power, increased channel density, and smaller form factors, placing greater demands on power delivery solutions. This session explores three µModule-based architectures designed to address these challenges in device power supplies: high-power bidirectional modules for main power rails, 60 V wide-input modules for compact bias rails, and Silent Switcher modules for extremely low-noise power delivery. The session provides practical, proven architecture options for power designers while highlighting the key advantages of the µModule approach—including higher power density, lower EMI, simplified design, and faster time to market—compared with discrete solutions.