(C12-5) An industry-wide position paper on chiplets as a driver of innovation and sovereignty

Chiplet-based electronic systems are a promising approach for implementing innovative modular solutions and electronic platforms for use in various industries. The transition to this approach requires more than just technology—it requires a unified ecosystem. Presenting the latest Chiplet Position Paper, we explore the critical need for interface standardization and advanced packaging infrastructure, outlining a strategic roadmap to build a robust European chiplet ecosystem. Join the authors as we discuss how cross-company collaboration is the key to unlocking the power of 3D IC and heterogeneous integration for the next generation of chips.