This Panel Discussion is moderated by Maurizio Di Paolo Emilio, Editor-in-Chief PowerElectronicsNews.com As silicon carbide and gallium nitride technologies continue to emerge in the power component market, companies are expanding and developing to offer an extensive portfolio of devices. In the last couple of years, the worldwide wide-bandgap scenes have been characterized by development and growing industry acceptance. In this panel discussion, we will explore the prospects and challenges of both technologies in multiple application contexts, as well as the last barriers to overcome for widespread adoption, such as large-volume capabilities and prices.