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Advanced customized organic substrates and packaging solutions required for state of the art miniaturization

15.11.2022 von 12:00 - 12:30

Halle A1 | Stand 263

Sprache: Englisch

Vortragsart: Vortrag


System level manufacturing in a high mix low to mid volume environment is a challenge every fabless OEM is facing. The challenge derives from the fact that the IC packaging market is controlled by OSATs that limit the design to their DR (design rules) and their business model is based on having low mix high volume production. Once the OEM designs a system the limitations of the OSAT affect its overall design at both board and final assembly levels. We would like to present a different approach. One that is based on system vertical integration.